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Applied Materials Unveils New Chipmaking Systems for 3D Scaling
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Applied Materials Unveils New Chipmaking Systems for 3D Scaling

By rawfin.tv Markets Desk||1 min read|AI-assisted · Methodology

Applied Materials has introduced two advanced chipmaking systems, Centris Spectral SiN ALD and Producer Selectra Mo Etch. These new deposition and selective etch technologies aim to enhance 3D chip scaling and boost semiconductor manufacturing capabilities.

Applied MaterialsSemiconductorsChip ManufacturingTech Innovation

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