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Malaysian Chipmaker SQAI Reportedly Plans $73 Million IPO by Early 2027
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Malaysian Chipmaker SQAI Reportedly Plans $73 Million IPO by Early 2027

By rawfin.tv Markets Desk||Updated |1 min read|AI-assisted · Methodology

Malaysian semiconductor firm SQ Advanced Interconnect Bhd. is reportedly considering an initial public offering to raise approximately 300 million ringgit ($73 million). The potential IPO is slated for early 2027, aiming to fund future growth.

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